October 6, 2025
STMicroelectronics has announced the launch of a new Panel-Level Packaging (PLP) pilot line at its Tours, France facility. With an investment of 60 million euros, the line is expected to enter service in the third quarter of 2026.
PLP is an advanced and automated technology for chip packaging and testing. Instead of traditional round wafers, it uses large rectangular substrates, enabling higher productivity and making it particularly efficient for high-volume production. PLP is key to creating smaller, more powerful, and cost-effective electronic devices.
This initiative is part of STMicroelectronics’ strategy for heterogeneous integration, an innovative approach that combines multiple technologies on a single chip. The new pilot line in Tours will support the development of RF, analog, power, and digital products, addressing the needs of automotive, industrial, and consumer electronics applications.
The project benefits from synergies with the local R&D ecosystem, including the CERTEM research center. A multidisciplinary team of experts in manufacturing automation, process engineering, data science, and technological and product R&D will contribute to this program.
Through this initiative, STMicroelectronics strengthens its presence in advanced semiconductor manufacturing in Europe. The pilot line in Tours represents a significant step toward innovation in chip packaging processes, supporting the development of the next generation of electronic devices.
